Huawei made headlines recently when word spread that Google will be asking the company to design the next Nexus phone. This time, Huawei is in the news for their upcoming chipsets.

The company is known for utilizing their own SoCs in their mobile devices instead of always relying on mainstream chipset makers. Their Kirin line of mobile device chipsets is about to get longer as 2015 progresses.

According to their timetable, the Kirin 930 will be seen in Q2, followed by the 940 in the third quarter, and lastly the 950 will arrive towards the end of the year.

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All three chipsets will have eight cores for their CPU, in a combination of 4 ARM Cortex A53s and 4 ARM Cortex A57s. The three will differ in terms of clocking speeds, where the 930 will operate at a maximum of 2.0GHz, the 940 will go up to 2.2GHz, and the 950 will be clocked to as high as 2.4GHz operation.

In all aspects, the capabilities of the chipsets will be improving, going from the 930 to 940 to 950.

The 930 will have a dual-channel LPDDR3 RAM chip and Tensilica HiFi 3 DSP with 1080p video encoding capabilities. The accompanying GPU will be the ARM Mali T628 while the ISP will be capable of up to 32MP. The sensor hub will be the i3 Co-Processor which is reportedly going to be replaced with the i5. It will have dual SIM capabilities for Cat 6 LTE speeds.

The 940 will be equipped with a dual channel LPDDR4 for the RAM, capable of data transfer at 25.6GB/s and dual 32MP ISP. Its accompanying GPU will be the ARM Mali T860 for graphics rendering, with capability of 4K video encoding. As a step up from the 930, it will be capable of Cat 7 LTE speeds, and will be sporting an i7 Co-Processor sensor hub instead of the i3.

Lastly, the 950 will be an improvement from the 940 in terms of the GPU, which will be the ARM Mali T880, as well as a dual 42MP ISP. It will also sport a Tensilica HiFi 4 DSP with 4K video encoding capabilities. For the LTE connectivity, the 950 will have Cat 10 data transfer speeds. Both the 940 and 950 will have NFC support, as well as Bluetooth 4.2.

It certainly looks like it will be an interesting year for Huawei. The Huawei Media Pad X2 and the P8 will both be equipped with the Kirin 930, and it shouldn’t be long before they begin announcing new phone models utilizing the more powerful 940 and 950 SoCs.

Huawei Upcoming Kirin Chipsets for 2015http://www.gizbeat.com/wp-content/uploads/huawei-chipsets2.jpghttp://www.gizbeat.com/wp-content/uploads/huawei-chipsets2-150x150.jpg Nicky Arriola HuaweiRecent
Huawei made headlines recently when word spread that Google will be asking the company to design the next Nexus phone. This time, Huawei is in the news for their upcoming chipsets. The company is known for utilizing their own SoCs in their mobile devices instead of always relying on mainstream...
Huawei made headlines recently when word spread that Google will be asking the company to design the next Nexus phone. This time, Huawei is in the news for their upcoming chipsets. <span id="more-6711"></span> The company is known for utilizing their own SoCs in their mobile devices instead of always relying on mainstream chipset makers. Their Kirin line of mobile device chipsets is about to get longer as 2015 progresses. According to their timetable, the Kirin 930 will be seen in Q2, followed by the 940 in the third quarter, and lastly the 950 will arrive towards the end of the year. <a href="http://www.gizbeat.com/wp-content/uploads/huawei-chipsets2.jpg"><img class="aligncenter size-full wp-image-6747" src="http://www.gizbeat.com/wp-content/uploads/huawei-chipsets2.jpg" alt="huawei-chipsets2" width="400" height="205" /></a> All three chipsets will have eight cores for their CPU, in a combination of 4 ARM Cortex A53s and 4 ARM Cortex A57s. The three will differ in terms of clocking speeds, where the 930 will operate at a maximum of 2.0GHz, the 940 will go up to 2.2GHz, and the 950 will be clocked to as high as 2.4GHz operation. In all aspects, the capabilities of the chipsets will be improving, going from the 930 to 940 to 950. The 930 will have a dual-channel LPDDR3 RAM chip and Tensilica HiFi 3 DSP with 1080p video encoding capabilities. The accompanying GPU will be the ARM Mali T628 while the ISP will be capable of up to 32MP. The sensor hub will be the i3 Co-Processor which is reportedly going to be replaced with the i5. It will have dual SIM capabilities for Cat 6 LTE speeds. The 940 will be equipped with a dual channel LPDDR4 for the RAM, capable of data transfer at 25.6GB/s and dual 32MP ISP. Its accompanying GPU will be the ARM Mali T860 for graphics rendering, with capability of 4K video encoding. As a step up from the 930, it will be capable of Cat 7 LTE speeds, and will be sporting an i7 Co-Processor sensor hub instead of the i3. Lastly, the 950 will be an improvement from the 940 in terms of the GPU, which will be the ARM Mali T880, as well as a dual 42MP ISP. It will also sport a Tensilica HiFi 4 DSP with 4K video encoding capabilities. For the LTE connectivity, the 950 will have Cat 10 data transfer speeds. Both the 940 and 950 will have NFC support, as well as Bluetooth 4.2. It certainly looks like it will be an interesting year for Huawei. The Huawei Media Pad X2 and the P8 will both be equipped with the Kirin 930, and it shouldn’t be long before they begin announcing new phone models utilizing the more powerful 940 and 950 SoCs.